Kemko® 051 LoMod IR
Low Modulus Epoxy Adhesive for Pressure Injection Grouting
Description
Kemko® 051, LoMod IR is a two-component, low viscosity, non-structural, epoxy adhesive designed for pressure injection grouting. The adhesive is suitable for installation with KIP System application equipment. Primary uses include non-structural,pressure injection grouting of cracks, delaminations and voids in rigid construction materials (e.g., concrete, masonry, stone, steel,wood and FRP) where repair with a low modulus epoxy resin adhesive is specified and waterstop filling of cracks, construction and control joints. Bonds rigid substrates to flexible elastomers including applications requiring mechanical/thermal shock resistance.Applications requiring material thickness in excess of 0.5 inch may be facilitated by preplacing aggregate in the void. Kemko® 051 bonds to dry, damp and wet substrates. The components do not contain volatile organic compounds (VOC’s).
Features
Kemko® 051, LoMod IR is a two-component, low viscosity, non-structural, epoxy adhesive designed for pressure injection grouting. The adhesive is suitable for installation with KIP System application equipment. Primary uses include non-structural, pressure injection grouting of cracks, delaminations and voids in rigid construction materials (e.g., concrete, masonry, stone, steel, wood and FRP) where repair with a low modulus epoxy resin adhesive is specified and waterstop filling of cracks, construction and control joints. Bonds rigid substrates to flexible elastomers including applications requiring mechanical/thermal shock resistance. Applications requiring material thickness in excess of 0.5 inch may be facilitated by preplacing aggregate in the void. Kemko® 051 bonds to dry, damp and wet substrates. The components do not contain volatile organic compounds (VOC’s).
Technical Data Sheet