Kemko® 051 LoMod IR

Low Modulus Epoxy Adhesive for Pressure Injection Grouting

Description

Kemko® 051, LoMod IR is a two-component, low viscosity, non-structural, epoxy adhesive designed for pressure injection grouting. The adhesive is suitable for installation with KIP System application equipment. Primary uses include non-structural,pressure injection grouting of cracks, delaminations and voids in rigid construction materials (e.g., concrete, masonry, stone, steel,wood and FRP) where repair with a low modulus epoxy resin adhesive is specified and waterstop filling of cracks, construction and control joints. Bonds rigid substrates to flexible elastomers including applications requiring mechanical/thermal shock resistance.Applications requiring material thickness in excess of 0.5 inch may be facilitated by preplacing aggregate in the void. Kemko® 051 bonds to dry, damp and wet substrates. The components do not contain volatile organic compounds (VOC’s).

Features


Kemko® 051, LoMod IR is a two-component, low viscosity, non-structural, epoxy adhesive designed for pressure injection grouting. The adhesive is suitable for installation with KIP System application equipment. Primary uses include non-structural, pressure injection grouting of cracks, delaminations and voids in rigid construction materials (e.g., concrete, masonry, stone, steel, wood and FRP) where repair with a low modulus epoxy resin adhesive is specified and waterstop filling of cracks, construction and control joints. Bonds rigid substrates to flexible elastomers including applications requiring mechanical/thermal shock resistance. Applications requiring material thickness in excess of 0.5 inch may be facilitated by preplacing aggregate in the void. Kemko® 051 bonds to dry, damp and wet substrates. The components do not contain volatile organic compounds (VOC’s).

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