Kemko® 022 Superseal™ is a two-component, non-sag, epoxy paste adhesive bonder designed for sealing cracks and delaminations in concrete, masonry, stone, steel, and wood in preparation for repair with the KIP™ (KEMKO® Injection Process) System automatic meter, mix, and dispense application equipment. It is ideally suited for surface sealing in cool and cold substrate and environments. KEMKO® 022 bonds to dry and damp substrates and can be applied up to 1/8 inch thick without sag or flow. It contains no VOC’s (volatile organic compounds).
KEMKO® 022 is fast curing and its excellent handling characteristics makes it a possible application over a wide range of substrate temperatures while minimizing the interval between crack sealing and pressure injection grouting, particularly at low ambient and substrate temperatures. Contrasting component colors provides a visual key to proper proportioning and thorough mixing. The buttery consistency and its cured film hardness enhance the production rates for seal application, injection, and subsequent removal.
Technical Data Sheet