Kemko® 009 SP Paste
Short Potlife Epoxy Paste Adhesive for Bonding
Description
Kemko® 009, SP Paste is a two-component, short potlife; structural epoxy paste adhesive designed for application on verticalsurfaces and in horizontal and overhead oriented holes. Primary uses include general bonding of rigid construction materials, e.g.,hardened concrete, masonry, stone, steel and sealed wood to themselves or each other, steel plate bonding (external reinforcement),bonding applications on vertical and overhead surfaces and anchoring bolts, dowels and rebar in horizontal and overhead orientedholes in concrete, masonry and stone. It also may be used as a KIP System surface seal in pressure injection grouting applications. Kemko® 009 bonds to dry, damp and wet (no free standing water) substrates and can be applied up to 1/2 inch thick without sag or flow.The components do not contain volatile organic compounds (VOC’s).
Features
The excellent physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures and high load bearing strength. Exceptional substrate wetting and water displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete. The working life/cure time of Kemko® 009, SP Paste may be increased, if required, by pre-blending the Part B with the Part B of the long potlife paste product, Kemko 028, LP Paste. The viscosity of Kemko® 009, SP Paste can be increased. Blending the mixed product with mixed companion paste product, Kemko® 008, SP Bonder. The long and short potlife and bonder and paste forms of the product (Kemko® 001, 008, 009 and 028) employ a 2:1 (by vol.) mixing ratio that must be maintained at all times.
Technical Data Sheet