Kemko® 008 SP Bonder
Short Pot Life Epoxy Liquid Adhesive for Bonding
Description
Kemko® 008 SP Bonder is a liquid two-component, short pot life, structural epoxy adhesive designed for application on horizontal surfaces and in vertical, downward oriented holes. Primary uses include the structural bonding of plastic (fresh) construction materials, e.g., hardened concrete, masonry, stone, steel, and wood to themselves or each other and anchoring bolts, dowels, and rebar into vertical, downward oriented holes in concrete, masonry, or stone.
Features
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, and high-load bearing strength. Exceptional substrate wetting and water displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete. The working life/cure time of Kemko 008 LP Bonder may be decreased, if required, by pre-blending Part B with Part B of the short pot life liquid product, Kemko® 008 SP Bonder. Blending the mixed product with a mixed companion paste product, Kemko® 009 SP Paste, will increase the viscosity of Kemko® 008 SP Bonder. The long and short pot life and bonder and paste forms of the product (Kemko® 001, 008, 009, and 028) employ a 2:1 (by vol.) mixing ratio that must be maintained at all times.
Technical Data Sheet