CCS™ HiAmb™ IR is a two-component, low viscosity, structural, epoxy adhesive. Primary uses include the structural repair of cracks and delaminations in concrete, masonry, stone and sealed wood, filling of voids in porous and honeycombed concrete and grout; adhesive bonding of steel plates (external reinforcement), anchoring bolts, dowels and rebar into concrete, masonry, or stone when the ambient air and/or substrate temperature at the time of installation is greater than approximately 90ºF. Applications requiring material thickness in excess of 1/4 inch (250 mils 6.35 mm) may be facilitated by pre-placing aggregate in the void. CCSTM HiAmbTM IR bonds to dry, damp and wet i.e., (free of standing water) substrates. The components do not contain volatile organic compounds (VOC’s).
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, high load bearing strength and excellent adhesion under adverse application conditions, e.g., hot, humid environments. Unlike many other high modulus epoxy adhesives, CCS™ HiAmb™ IR cures to a tough, resilient polymer and has excellent load transfer capability. Exceptional substrate wetting and extended working life ensure penetration and filling of fine fissures and tributary cracks in warm environments. It has a convenient 2:1 (by vol.) mixing ratio and employs special colorants for contrasting component color.
Technical Data Sheet