Kemko® 171 SP Paste
Short Pot Life Epoxy Paster Adhesive for Bonding
Description
Kemko® 171 SP Paste is a paste two-component, short pot life, structural epoxy adhesive designed for application on horizontal surfaces and in vertical surfaces and overhead, horizontal and vertical holes. Primary uses include the structural bonding hardened to hardened concrete, masonry, stone, steel, and wood to themselves or each other and anchoring bolts, dowels, and rebar into overhead, horizontal and vertical holes in concrete, masonry, or stone. It is use to fill wide cracks, delaminations, gaps and voids, as a fairing and leveling paste with or without aggregate fillers.
Features
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, and high-load bearing strength. Exceptional substrate wetting and water displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete. The working life/cure time of KEMKO® 001, LP Bonder may be decreased, if required, by pre-blending Part B with Part B of the short pot life liquid product, KEMKO® 008, SP Bonder. Blending the mixed product with a mixed companion paste product, KEMKO® 028, LP Paste, will increase the viscosity of KEMKO® 001, LP Bonder. The long and short pot life and bonder and paste forms of the product (KEMKO® 001, 008, 009, and 028) employ a 2:1 (by vol.) mixing ratio that must be maintained at all times.
Technical Data Sheet