Description

Kemko^® 019, LoTempSEAL is a two-component, non-sag, epoxy paste adhesive designed for sealing cracks and delaminations in concrete, masonry, stone, steel and sealed wood In preparation repair with KIPTM System pressure injection grouting. It alsomay be used as a bonding adhesive for most rigid construction materials and is ideally suited for bonding applications in cool andcold environments. Kemko^® 019 bonds to dry, damp and wet (no free standing water) substrates and can be applied up to 1/2 inch thick without sag or flow. The components do not contain volatile organic compounds (VOC’s).

Features

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The low temperature reactivity of Kemko^® 019 makes it ideally suited for crack sealing on cool and cold substrates where thin film high strength and hardness are required and when an extended low temperature cure time is not a constraint. The product has sufficient working life for use as a crack sealer or bonding adhesive at moderate substrate temperatures. It has a convenient 2:1 (by vol.) mixing ratio and is formulated for similar A and B component viscosities for ease of mixing. Contrasting component colors provides a visual key to proper proportioning and thorough mixing. The buttery, non-sag consistency facilitates the measuring and mixing of small quantities and enhances applicator production rates.

Technical Data Sheet

Resources

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Brochure

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