Kemko® 001 LP Liquid Bonder
Bonder - Long Pot Life, Structural Epoxy Adhesive Bonding Agent
Description
KEMKO® 001 LP Bonder is a liquid two-component, long pot life, low exotherm structural epoxy adhesive designed for application on horizontal surfaces and in vertical, downward oriented holes. Primary uses include the structural bonding of plastic (fresh) concrete and other construction materials, e.g., hardened concrete, masonry, stone, steel, and wood to themselves or each other and anchoring bolts, dowels, and rebar into vertical, downward oriented holes in concrete, masonry, or stone. The product is ideally suited for applications requiring significant manual labor (due usually to restricted access to the substrate) and when a long cure time is not a constraint. It offers vastly superior bond strength compared to acrylic/PVA emulsion bonding agents. It is used for filling small and large voids, with and without aggregate extension. It is also used for repairing delaminations of hardened concrete to hardened concrete or delamination of topping slabs. It can be used for bonding external steel reinforcement for changes in design loads and K-Bracing for seismic reinforcement. Its long working time makes it ideal for placing with plural and single component spray rigs. It bonds to dry and damp substrates; wet substrates must be free of standing water. No SiO2 (silica sand fillers are used as a low-cost filler or to control viscosity) is used in the manufacturing of KEMKO® 001. It contains no VOC’s (volatile organic compounds).
- Meets - ASTM C881, Type I, II, IV and V, Grade 2, Class C and AASTHO M235, Type I, II, IV and V, Grade 2, Class C.
- Meets - ACI 548.13-14 Specification for Bonding Fresh Concrete to Hardened Concrete with a Multi-Component Epoxy Adhesive.
Features
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, and highload bearing strength. Exceptional substrate wetting and water displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete.
- Decrease working life/cure KEMKO® 001 LP Bonder by blending its Part B with the Part B of the short pot life KEMKO® 008 SP Bonder
- Increase viscosity of KEMKO® 001 LP Bonder by blending its Part B with Part B of the long pot life KEMKO® 028 LP Bonder